NFC Equipment: Difference between revisions

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* [[EBL]]
* [[EBL]]
** Electron beam lithography
** Electron beam lithography

* [[PECVD]]
** Plasma enhanced chemical vapor deposition

Revision as of 21:31, 1 December 2021

  • Metal Evaporator
    • For deposition of thin films of metals (most commonly used for Au)
  • RIE
    • For etching of materials (PMMA, Si, SiO2. etc)
  • EBL
    • Electron beam lithography
  • PECVD
    • Plasma enhanced chemical vapor deposition