NFC Equipment: Difference between revisions

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(starting nfc equipment list)
 
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* [[RIE]]
* [[RIE]]
** For etching of materials (PMMA, Si, SiO2. etc)
** For etching of materials (PMMA, Si, SiO2. etc)
* [[EBL]]
** Electron beam lithography

Revision as of 20:01, 4 October 2021

  • Metal Evaporator
    • For deposition of thin films of metals (most commonly used for Au)
  • RIE
    • For etching of materials (PMMA, Si, SiO2. etc)
  • EBL
    • Electron beam lithography