NFC Equipment: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 9: | Line 9: | ||
* [[PECVD]] |
* [[PECVD]] |
||
** Plasma enhanced chemical vapor deposition |
** Plasma enhanced chemical vapor deposition |
||
* [[ALD]] |
|||
** Atomic Layer Deposition |
|||
Latest revision as of 21:39, 1 December 2021
- Metal Evaporator
- For deposition of thin films of metals (most commonly used for Au)
- PECVD
- Plasma enhanced chemical vapor deposition
- ALD
- Atomic Layer Deposition