NFC Equipment: Difference between revisions
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(starting nfc equipment list) |
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* [[RIE]] |
* [[RIE]] |
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** For etching of materials (PMMA, Si, SiO2. etc) |
** For etching of materials (PMMA, Si, SiO2. etc) |
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* [[EBL]] |
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** Electron beam lithography |
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* [[PECVD]] |
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** Plasma enhanced chemical vapor deposition |
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* [[ALD]] |
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** Atomic Layer Deposition |
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Latest revision as of 21:39, 1 December 2021
- Metal Evaporator
- For deposition of thin films of metals (most commonly used for Au)
- PECVD
- Plasma enhanced chemical vapor deposition
- ALD
- Atomic Layer Deposition