brarlab - User contributions [en]

Metal Evaporator

2022-03-23T15:51:25Z

Mfortman2:

To calculate Iterative Tooling Factor = Used Tooling Factor x ( Measured Thickness / Nominal Thickness) then round to nearest percent.
{| class="wikitable"
|-
! User !! Date !! Source !! Dep Rate (A/s) !! Current (mA) !! Nominal Thickness (nm) !! Measured Thickness (nm)
!Tooling Factor Used (%)
!Iterative Tooling Factor (%)
|-
| MF || 10/27/21 || Au || 1.5 || 145 || 100 ||
|
|
|-
|GH
|11/10/21
|Au (and 2 nm Ti)
|2.0
|67
|122
|123
|77
|78
|-
|GH
|11/10/21
|Hf
|<0.1
|91
|1.5
|
|77
|
|-
|JS
|11/10/21
|Cr/Au/Si
|1/2/2
|14/60/65
|2.5/30/50 (and 80)
|
|77
|
|-
|MF
|11/16/21
|Cr/Au
|0.8/1.9
|13/73
|4/50
|
|77
|
|-
|MF
|11/29/21
|Au
|2.1
|66
|75
|
|77
|
|-
|GJ
|1/19/22
|Cr
|1.0
|12-13
|20
|
|77
|
|-
|GJ
|1/21/22
|Cr
|1.0
|15
|20
|
|77
|
|-
|GJ
|1/28/22
|Cr
|1.0
|17-20
|20
|
|77
|
|-
|MF
|3/23/22
|Cr/Au
|1.5/2.6
|10/68
|4/54
|
|77
|
|}

PECVD

2021-12-06T16:00:17Z

Mfortman2:

{| class="wikitable"
|+Plasma-Therm 70 Series
|-
! User !! Date !! Recipe !! Material
!Time !! Nominal Thickness (nm) !! Measured Thickness (nm) !! Deposition rate
!Comments
|-
|MF
|11/23/21
|SiOxide2
|SiO2
|333 seconds
|200nm
|190 nm
|.57 nm/s
|20211122 test sample to determine dep rate
|-
|MF
|12/6/21
|SiOxide2
|SiO2
|350 seconds
|200nm
|
|
|20210922A sample for Nb junctions
|-
|}

PECVD

2021-12-02T22:36:54Z

Mfortman2:

ALD

2021-12-02T21:35:13Z

Mfortman2:

{| class="wikitable"
|+Fiji ALD
|-
! User !! Date !! Recipe !! Material !! Nominal Thickness
!Measured Thickness
!Comments
|-
|MF
|3/22/21
|NbN 300C - Plasma
|NbN
|30 nm
|
|3 Si chips
|-
|MF
|4/7/21
|NbN 300C - Plasma w boost
|NbN
|40 nm
|
|Error in recipe
|-
|MF
|7/21/21
|NbN 300C - Plasma - Bubble - Plasma Clean
|NbN
|40 nm
|
|1 W STM tip in holder, 6 Si chips
|-
|MF
|8/23/21
|NbN 350C - Plasma - Bubble - Plasma Clean
|NbN
|40 nm
|37,39,41 nm
|2 W STM tips in holders, 5 Si chips
|-
| MF || 11/17/21 || NbN 350C - Plasma - Bubble - Plasma Clean || NbN || 40 nm
|39-43 nm
|4 tips chip, PtIr STM tip in holder (masked to electrically isolate), 5 Si chips
|-
|MF
|12/2/21
|NbN 350C - Plasma - Bubble - Plasma Clean
|NbN
|40 nm
|
|2 13x13mm Si chips, etc.
|-
|}

ALD

2021-12-01T22:05:18Z

Mfortman2:

ALD

2021-12-01T21:53:01Z

Mfortman2:

{| class="wikitable"
|+Fiji ALD
|-
! User !! Date !! Recipe !! Material !! Nominal Thickness
!Measured Thickness
!Comments
|-
|MF
|7/21/21
|NbN 300C - Plasma - Bubble - Plasma Clean
|
|
|
|
|-
|MF
|8/23/21
|NbN 350C - Plasma - Bubble - Plasma Clean
|NbN
|40 nm
|37,39,41 nm
|2 W STM tips in holders, 5 Si chips
|-
| MF || 11/17/21 || NbN 350C - Plasma - Bubble - Plasma Clean || NbN || 40 nm
|39-43 nm
|4 tips chip, PtIr STM tip in holder (masked to electrically isolate), 5 Si chips
|-
|}

ALD

2021-12-01T21:50:51Z

Mfortman2:

{| class="wikitable"
|+Fiji ALD
|-
! User !! Date !! Recipe !! Material !! Nominal Thickness
!Measured Thickness
!Comments
|-
|MF
|8/23/21
|NbN 350C - Plasma - Bubble - Plasma Clean
|NbN
|40 nm
|
|
|-
| MF || 11/17/21 || NbN 350C - Plasma - Bubble - Plasma Clean || NbN || 40 nm
|39-43 nm
|4 tips chip, PtIr STM tip in holder (masked to electrically isolate), 5 Si chips
|-
|}

ALD

2021-12-01T21:39:30Z

Mfortman2: Created page with "{| class="wikitable" |+Unaxis 790 RIE |- ! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate !Comments |- | Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 s |..."

{| class="wikitable"
|+Unaxis 790 RIE
|-
! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate
!Comments
|-
| Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 s || 80 nm/m
|
|-
|MF
|10/27/21
|NbEtch
|Nb on junctions
|90
|195 s
|
|
|-
|JS
|11/10/21
|50_10_10
|PMMA/Neutral Layer/Graphene/SiO2/Si
|
|10
|N/A Descum
|
|-
|MF
|11/22/21
|NbEtch
|Nb wire
|
|100 minutes
|
|4 wires in Mo holder
|-
|MF
|12/1/21
|50CHF3
|SiO2
|<200nm
|11.75 minutes
|
|Test sample for PECVD dep rate
|-
|}

NFC Equipment

2021-12-01T21:39:20Z

Mfortman2:

* [[Metal Evaporator]]
** For deposition of thin films of metals (most commonly used for Au)

* [[RIE]]
** For etching of materials (PMMA, Si, SiO2. etc)
* [[EBL]]
** Electron beam lithography

* [[PECVD]]
** Plasma enhanced chemical vapor deposition

* [[ALD]]
** Atomic Layer Deposition

PECVD

2021-12-01T21:38:30Z

Mfortman2:

{| class="wikitable"
|+Plasma-Therm 70 Series
|-
! User !! Date !! Recipe !! Material
!Time !! Nominal Thickness (nm) !! Measured Thickness (nm) !! Deposition rate
!Comments
|-
|MF
|11/23/21
|SiOxide2
|SiO2
|333 seconds
|200nm
|
|
|20211122 test sample to determine dep rate
|-
|}

PECVD

2021-12-01T21:34:41Z

NFC Equipment

2021-12-01T21:31:52Z

Mfortman2:

EBL

2021-12-01T21:30:43Z

Mfortman2:

{| class="wikitable"
|+ Caption text
|-
! User !! Date
!Resist!! Dose (uC/cm2) !! Write File !! Picture/Notes
|-
| MF || 10/22/21
| 950 spun at 4000RPM, 60s 180C bake|| 2000 || bigtip_40um.dxf || Pattern for etching big (40um) tip
|-
|MF
|10/29/21
|Bilayer 495/950, 1800RPM, 60s 180C bake
|900
|junctions_200nm.dxf
|200nm break junctions
|-
|MF
|11/2/21
|950 spun at 4000RPM, 60s 180C bake
|2000
|4tips_40um.dxf
|Pattern for etching a big tip (40um) at each corner
|-
|JS
|11/8/21
|950 Spun at 4000 RPM, 90 sec 180 C Bake
|1500-3000
|Aligned_ribbons.dxf
|800 nm bars with 180 nm gaps for aligned BCP
|-
|MF
|11/10/21
|Bilayer 495/950, 1800RPM, 60s 180C bake
|900
|junctions_200nm.dxf
|200nm break junctions
|-
|JS
|11/11/21
|HSiQ: 3000 RPM
|1150
|SiN_40nm_Thermal_Wires
|40 nm wires with 2 micron gaps for SiN thermal steerer
|-
|MF
|11/16/21
|Bilayer 495/950, 1800RPM, 60s 180C bake
|900
|junctionswshorts2.dxf
|200nm break junctions w shorts on one side
|-
|MF
|11/29/21
|Bilayer 495/950, 1800RPM, 60s 180C bake
|900
|junctionswshorts_bottom2c.dxf & junctionswshorts_top1.dxf
|Redo one from 11/16/21
|-
|MF
|11/30/21
|Bilayer 495/950, 1800RPM, 60s 180C bake
|900
|junctionswshorts_bottom2c.dxf & junctionswshorts_top1.dxf
|Redo other from 11/16/21
|}

Metal Evaporator

2021-12-01T21:21:11Z

Mfortman2:

RIE

2021-12-01T21:16:40Z

Mfortman2:

Metal Evaporator

2021-11-05T16:07:44Z

Mfortman2:

{| class="wikitable"
|-
! User !! Date !! Source !! Dep Rate !! Current !! Nominal Thickness !! Measured Thickness
!Iterative Tooling Factor
|-
| MF || 10/27/21 || Au || 1.5 A/s || 145mA || 100nm ||
|
|}

EBL

2021-11-03T03:04:39Z

Mfortman2:

{| class="wikitable"
|+ Caption text
|-
! User !! Date !! Dose (uC/cm2) !! Write File !! Picture/Notes
|-
| MF || 10/22/21 || 2000 || bigtip_40um.dxf || Pattern for etching big (40um) tip
|-
|MF
|10/29/21
|900
|junctions_200nm.dxf
|200nm break junctions
|-
|MF
|11/2/21
|2000
|4tips_40um.dxf
|Pattern for etching a big tip (40um) at each corner
|}

EBL

2021-10-29T14:56:50Z

Mfortman2:

RIE

2021-10-27T16:36:17Z

Mfortman2:

{| class="wikitable"
|+Unaxis 790 RIE
|-
! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate
|-
| Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 s || 80 nm/m
|-
|MF
|10/27/21
|NbEtch
|Nb on junctions
|90
|195 s
|
|-
|}

Metal Evaporator

2021-10-27T16:34:48Z

Mfortman2:

{| class="wikitable"
|-
! User !! Date !! Source !! Dep Rate !! Current !! Nominal Thickness !! Measured Thickness
|-
| MF || 10/27/21 || Au || 1.5 A/s || 145mA || 100nm ||
|}

Metal Evaporator

2021-10-27T16:33:19Z

Mfortman2:

{| class="wikitable"
|+ Caption text
|-
! User !! Date !! Source !! Dep Rate !! Current !! Nominal Thickness !! Measured Thickness
|-
| MF || 10/27/21 || Au || 1.5 A/s || 145mA || 100nm ||
|}

EBL

2021-10-27T16:29:29Z

Mfortman2:

{| class="wikitable"
|+ Caption text
|-
! User !! Date !! Dose (uC/cm2) !! Write File !! Picture/Notes
|-
| MF || 10/22/21 || 2000 || bigtip_40um.dxf || Pattern for etching big (40um) tip
|}

EBL

2021-10-27T16:28:54Z

Mfortman2: Created page with "{| class="wikitable" |+ Caption text |- ! User !! Date !! Dose (uC/cm2) !! Write File !! Picture/Notes |- | MF || 10/22/21 || 2000 || bigtip_40um.dxf || Pattern for etching bi..."

{| class="wikitable"
|+ Caption text
|-
! User !! Date !! Dose (uC/cm2) !! Write File !! Picture/Notes
|-
| MF || 10/22/21 || 2000 || bigtip_40um.dxf || Pattern for etching big (40um) tip
|-
| Example || Example || Example || Example || Example
|-
| Example || Example || Example || Example || Example
|}

RIE

2021-10-27T16:22:19Z

Mfortman2:

{| class="wikitable"
|+Unaxis 790 RIE
|-
! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate
|-
| Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 secs || 80 nm/m
|-
|}

RIE

2021-10-27T16:21:42Z

Mfortman2: Created page with "{| class="wikitable" |+ Caption text |- ! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate |- | Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 secs || 80 nm/..."

{| class="wikitable"
|+ Caption text
|-
! User !! Date !! Recipe !! Material !! Thickness !! Time !! Etch Rate
|-
| Ex || 04/02/19 || NbEtch || Nb || 40nm || 30 secs || 80 nm/m
|-
|}